Kisling ergo® 7390 is a solvent-free epoxy resin developed for molding and coating applications in the electronics industry. The resin offers excellent mechanical properties along with high heat resistance. Once cured, it forms a dry, non-sticky, hard surface. It has excellent adhesion to metals, ceramics, and rigid plastics.

Features

Product Category Epoxy resin - Molding compound

Colour transparent (after curing)

Density [g/cm3] ~0.98 (mixture)

Mixing Ratio 4:1 (A:D)

Viscosity [mPas] ~500 (mix)

Initial Curing Time [min] ~45

Final Curing time [Hour] <16 (at 40°C)

Operating temperature range [°C] (-40°C) – (+180°C)

Standard Package Dimensions 1kg